<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>47</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Mitsuru Kambe</style></author><author><style face="normal" font="default" size="100%">T. Jinushi</style></author><author><style face="normal" font="default" size="100%">Z. Ishijima</style></author></authors><secondary-authors><author><style face="normal" font="default" size="100%">Harald Bottner</style></author></secondary-authors></contributors><titles><title><style face="normal" font="default" size="100%">Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems</style></title><secondary-title><style face="normal" font="default" size="100%">Proceedings of the 28th International Conference on Thermoelectrics:, ICT2009</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2009</style></year><pub-dates><date><style  face="normal" font="default" size="100%">26/07/2009</style></date></pub-dates></dates><urls><related-urls><url><style face="normal" font="default" size="100%">http://www.its.org/system/files/JEMS-1338-o.fdf</style></url></related-urls></urls><pub-location><style face="normal" font="default" size="100%">Freiburg, Germany</style></pub-location></record></records></xml>