Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems

Printer-friendly versionPDF version
TitleEncapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems
Publication TypeConference Paper
Year of Publication2009
AuthorsKambe M, Jinushi T, Ishijima Z
Conference NameProceedings of the 28th International Conference on Thermoelectrics:, ICT2009
Conference Start Date26/07/2009
Conference LocationFreiburg, Germany
EditorBottner H
Full Text
AttachmentSize
JEMS-1338-o.fdf628.94 KB

Bibliography: