[ICT/ACT2019] Abstract Submission/Publication(JEM)

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Secretariat, The ICT/ACT2019 Organizing Committee





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Dear fellows!

The spring is coming again with flowers and buds here in Gyeongju, Korea where is the venue of ICT/ACT 2019. We wish your plans for the New Year go as smoothly as spring breeze, one by one.

We believe your preparation of the paper for the ICT/ACT 2019 is going well, too. It is just a reminder that the deadline of the abstract submission is approaching by this weekend (March 15). Your early submission will be greatly appreciated if you plan for it.

The 2019 ICT proceedings will be published again as an article collection in the Journal of Electronic Materials (JEM) like we did before.

Please refer to the following information.

Best regards,

The Organizing committees of the ICT/ACT 2019



Manuscripts should be submitted online at http://www.editorialmanager.com/jems/default.aspx. Authors should choose the article type “2019 ICT” from the dropdown menu. Manuscripts for the 2019 ICT collection will be evaluated according to the same high standards as would be applied to any article submitted to the journal. Authors are encouraged to read carefully and comply with the "Instructions for Authors" on the JEM website. Submitted papers will go through a plagiarism check to evaluate overlap with previously published work. The deadline for the submission of manuscripts is August 21, 2019. Manuscripts submitted after this deadline will not be considered for the collection; however, late submissions may still be considered for publication in another issue of the journal as an original article at the discretion of the Editors.



  • Close for abstract submission: March 31(Sun), 2019
  • Decision/notification on abstracts submitted: March 30 (Sat), 2019
  • End of early registration: April 30 (Tue), 2019
  • End of on-line registration: June 15 (Sat), 2019



Ⅰ. Thermoelectric Applications: Present and Future

  • Industrial Applications
  • Home Appliances
  • Automobile / Space Applications
  • Wearable & Flexible Applications
  • Heat Management
  • Others

II. Thermoelectric Modules and Devices

  • Cooling
  • Power Generation
  • Sensors
  • Design
  • Interfaces and Junctions (Thermal Interface Materials)
  • Hybrid Device Architecture (TE + Solar + Fuel cell +…)
  • Others

III: Thermoelectric Characterization and New Phenomena

  •  Novel Characterization
  • Novel Phenomena
  • Device Evaluation and Characterization
  • Thermal Transport and Phonon
  • Spin and Magnetism

IV. Thermoelectric Materials

  • New Materials and New Concepts
  • Organic and Hybrid Materials
  • Oxides and Half-Heuslers
  • Zintl Phases
  • Chalcogenides
  • Silicides
  • Pnictides
  • Theory and Modeling
  • Big Data and Data Mining

       *The AAT Summer School (Tutorial) will be held on June 30(Sun), 2019


Secretariat, The ICT/ACT2019 Organizing Committee

 313 Smart Bldg., Jeju Science Park, 213-3 Chumdan-ro, Jeju, Korea

 H. ict2019.kr  T.+82-64-748-1040  F. +82-64-746-9317  E. ict2019@nuricomm.net