25th International Conference on Thermoelectrics (ICT2006)
August 6-10, 2006
Wien, Austria
Contact: Prof. Peter Rogl ict2006 [at] its [dot] org http://www.its.org/ict2006
Organized by the University of Vienna, Austria, Europe
25th International Conference on Thermoelectrics (ICT2006)
August 6-10, 2006
Wien, Austria
Contact: Prof. Peter Rogl ict2006 [at] its [dot] org http://www.its.org/ict2006
Organized by the University of Vienna, Austria, Europe
25th International Conference on Thermoelectrics (ICT2006)
August 6-10, 2006
Wien, Austria
Contact: Prof. Peter Rogl ict2006 [at] its [dot] org http://www.its.org/ict2006
Organized by the University of Vienna, Austria, Europe
25th International Conference on Thermoelectrics (ICT2006)
August 6-10, 2006
Wien, Austria
Contact: Prof. Peter Rogl ict2006 [at] its [dot] org http://www.its.org/ict2006
Organized by the University of Vienna, Austria, Europe
25th International Conference on Thermoelectrics (ICT2006)
August 6-10, 2006
Wien, Austria
Contact: Prof. Peter Rogl ict2006 [at] its [dot] org http://www.its.org/ict2006
Organized by the University of Vienna, Austria, Europe
all for Papers Thermal Challenges in Next Generation Electronic Systems (THERMES 2007) January 7-10, 2007 Santa Fe, New Mexico Abstracts due: June 9, 2006 As electronic products become faster and incorporate greater functionality, they are shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are critical at all levels of the electronic product hierarchy, from the chip to the system. This conference will focus on two main themes in electronics cooling: a heavy emphasis will be placed on a discussion of the expected future demands in the next 10-15 years on thermal management systems and the many possible solutions to these increased demands and attention will be focused on the significant recent advances in thermal management and characterization schemes which have occurred since the highly successful initial THERMES conference held in January 2002.
all for Papers Thermal Challenges in Next Generation Electronic Systems (THERMES 2007) January 7-10, 2007 Santa Fe, New Mexico Abstracts due: June 9, 2006 As electronic products become faster and incorporate greater functionality, they are shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are critical at all levels of the electronic product hierarchy, from the chip to the system. This conference will focus on two main themes in electronics cooling: a heavy emphasis will be placed on a discussion of the expected future demands in the next 10-15 years on thermal management systems and the many possible solutions to these increased demands and attention will be focused on the significant recent advances in thermal management and characterization schemes which have occurred since the highly successful initial THERMES conference held in January 2002.
all for Papers Thermal Challenges in Next Generation Electronic Systems (THERMES 2007) January 7-10, 2007 Santa Fe, New Mexico Abstracts due: June 9, 2006 As electronic products become faster and incorporate greater functionality, they are shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are critical at all levels of the electronic product hierarchy, from the chip to the system. This conference will focus on two main themes in electronics cooling: a heavy emphasis will be placed on a discussion of the expected future demands in the next 10-15 years on thermal management systems and the many possible solutions to these increased demands and attention will be focused on the significant recent advances in thermal management and characterization schemes which have occurred since the highly successful initial THERMES conference held in January 2002.
all for Papers Thermal Challenges in Next Generation Electronic Systems (THERMES 2007) January 7-10, 2007 Santa Fe, New Mexico Abstracts due: June 9, 2006 As electronic products become faster and incorporate greater functionality, they are shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are critical at all levels of the electronic product hierarchy, from the chip to the system. This conference will focus on two main themes in electronics cooling: a heavy emphasis will be placed on a discussion of the expected future demands in the next 10-15 years on thermal management systems and the many possible solutions to these increased demands and attention will be focused on the significant recent advances in thermal management and characterization schemes which have occurred since the highly successful initial THERMES conference held in January 2002.
TMS Electronic Materials Conference (EMC) … the premier annual forum on the preparation and characterization of electronic materials.
The 2007 conference will be located at the University of Notre Dame, in Indiana, from June 20 through June 22.
Who Attends?
Individuals actively engaged or interested in electronic materials research and development including scientists, engineers, researchers, technicians, R&D managers, product managers, professors and students.
TMS proudly sponsors the 49th EMC which presents both invited and contributed oral presentations, an exhibition and related activities. Sponsored by TMS Electronic, Magnetic & Photonic Materials Division.
TMS Electronic Materials Conference (EMC) … the premier annual forum on the preparation and characterization of electronic materials.
The 2007 conference will be located at the University of Notre Dame, in Indiana, from June 20 through June 22.
Who Attends?
Individuals actively engaged or interested in electronic materials research and development including scientists, engineers, researchers, technicians, R&D managers, product managers, professors and students.
TMS proudly sponsors the 49th EMC which presents both invited and contributed oral presentations, an exhibition and related activities. Sponsored by TMS Electronic, Magnetic & Photonic Materials Division.
Printer-friendly version
PDF version